Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8703583 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Ryuichi Takano, Yoshiaki Makita, Haruhiko Fukasawa +1 more | 2014-04-22 |
| 7629231 | Fabrication method of semiconductor device | Hiroshi Maki, Masayuki Mochizuki, Ryuichi Takano, Yoshiaki Makita, Haruhiko Fukasawa +1 more | 2009-12-08 |
| 6898848 | Method of bonding inner leads to chip pads | Tatsuyuki Ohkubo, Yoshifumi Katayama | 2005-05-31 |
| 6516515 | Semiconductor integrated circuit | Tatsuyuki Ohkubo, Yoshifumi Katayama | 2003-02-11 |
| 6279226 | Lead bonding machine for bonding leads of a chip disposed over a carrier tape to an electrode pad formed on the chip | Tatsuyuki Ohkubo, Yoshifumi Katayama | 2001-08-28 |