Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062588 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon | 2024-08-13 |
| 11508635 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon | 2022-11-22 |
| 10685897 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon | 2020-06-16 |
| 10049954 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon | 2018-08-14 |
| 9633932 | Lead frame package having discharge hole and method of manufacturing the same | Kyoung Yeon Lee, Byong Jin Kim, Kyung Su Kim, Hyung Il Jeon | 2017-04-25 |
| 9054089 | Lead frame package having discharge holes and method of manufacturing the same | Kyoung Yeon Lee, Byong Jin Kim, Kyung Su Kim, Hyung Il Jeon | 2015-06-09 |