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Semiconductor package having routable encapsulated conductive substrate and method |
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Semiconductor package having routable encapsulated conductive substrate and method |
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2022-11-22 |
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Semiconductor package having routable encapsulated conductive substrate and method |
Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon |
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| 10049954 |
Semiconductor package having routable encapsulated conductive substrate and method |
Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon |
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| 9633932 |
Lead frame package having discharge hole and method of manufacturing the same |
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| 9054089 |
Lead frame package having discharge holes and method of manufacturing the same |
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2015-06-09 |