Issued Patents All Time
Showing 25 most recent of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424524 | Semiconductor devices and methods of manufacturing semiconductor devices | Shaun Bowers, Yoshio Matsuda, Hyung Il Jeon, Byong Jin Kim, Jae Min Bae +2 more | 2025-09-23 |
| 12334420 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Yong Ho Son, Byong Jin Kim, Jae Min Bae, Seung Woo Lee | 2025-06-17 |
| 12131982 | Electronic package structure with reduced vertical stress regions | Tae Kyung Hwang, Eun Sook Sohn, Won Joon Kang | 2024-10-29 |
| 12062588 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Jae Doo Kwon, Hyung Il Jeon | 2024-08-13 |
| 12062833 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2024-08-13 |
| 12057378 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Byong Jin Kim, Junichiro Abe | 2024-08-06 |
| 11961794 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Byong Jin Kim, Ji Young Chung | 2024-04-16 |
| 11908779 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Ji Young Chung | 2024-02-20 |
| 11887916 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Yong Ho Son, Byong Jin Kim, Jae Min Bae, Seung Woo Lee | 2024-01-30 |
| 11677135 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2023-06-13 |
| 11508635 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Jae Doo Kwon, Hyung Il Jeon | 2022-11-22 |
| 11018079 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Ji Young Chung | 2021-05-25 |
| 11011455 | Electronic package structure with improved board level reliability | Tae Kyung Hwang, Eun Sook Sohn, Won Joon Kang | 2021-05-18 |
| 10910298 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Byong Jin Kim, Ji Young Chung | 2021-02-02 |
| 10685897 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Jae Doo Kwon, Hyung Il Jeon | 2020-06-16 |
| 10645613 | Method and apparatus for generating packet in mobile communication system | Han Na Lim, Sung Won Lee, Jung-Shin Park | 2020-05-05 |
| 10224218 | Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure | Won Bae Bang, Byong Jin Kim, Ji Young Chung | 2019-03-05 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ju Hoon Yoon, Ji Young Chung, Byong Jin Kim, Choon Heung Lee | 2019-01-08 |
| 10049954 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Jae Doo Kwon, Hyung Il Jeon | 2018-08-14 |
| 9966652 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2018-05-08 |
| 9929075 | Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity | Tae Kyung Hwang, Eun Sook Sohn, Won Joon Kang | 2018-03-27 |
| 9922919 | Electronic package structure having insulated substrate with lands and conductive patterns | Won Bae Bang, Byong Jin Kim, Ji Young Chung | 2018-03-20 |
| 9911685 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Ji Young Chung | 2018-03-06 |
| 9552999 | Packaged electronic device having reduced parasitic effects and method | Tae Ki Kim, Byong Jin Kim, Ji Young Chung, Won Bae Bang | 2017-01-24 |
| 9472494 | Lead frame for semiconductor device | Joon Su Kim, Jung Soo Park | 2016-10-18 |