Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431611 | Semiconductor devices and methods of manufacturing semiconductor devices | Corey Reichman, Se Man Oh, Byong Jin Kim | 2025-09-30 |
| 12300584 | Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof | Hyung Jun Cho, Tae Yong Lee, Jae Min Bae | 2025-05-13 |
| 12278154 | Semiconductor device and a method of manufacturing a semiconductor device | Se Man Oh, Sang-Hyeon Lee, Min Cheol Shin | 2025-04-15 |
| 12243834 | Semiconductor package with EMI shield and fabricating method thereof | Doo Soub Shin, Tae Yong Lee, Sung Gyu Kim | 2025-03-04 |
| 12046798 | Semiconductor devices and methods of manufacturing semiconductor devices | Corey Reichman, Se Man Oh, Byong Jin Kim | 2024-07-23 |
| 11967567 | Semiconductor package with EMI shield and fabricating method thereof | Doo Soub Shin, Tae Yong Lee, Sung Gyu Kim | 2024-04-23 |
| 11915998 | Semiconductor device and a method of manufacturing a semiconductor device | Hyung Jun Cho, Tae Yong Lee, Jae Min Bae | 2024-02-27 |
| 11908779 | Land structure for semiconductor package and method therefor | Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2024-02-20 |
| 11742565 | Semiconductor devices and methods of manufacturing semiconductor devices | Tae Yong Lee, Doo Soub Shin, Seon Ae Lee, Woo Bin Jung, Ji Yeon Ryu +1 more | 2023-08-29 |
| 11664289 | Semiconductor device and a method of manufacturing a semiconductor device | Se Man Oh, Sang-Hyeon Lee, Min Cheol Shin | 2023-05-30 |
| 11637073 | Semiconductor package with EMI shield and fabricating method thereof | Doo Soub Shin, Tae Yong Lee, Sung Gyu Kim | 2023-04-25 |
| 11521918 | Semiconductor device having component mounted on connection bar and lead on top side of lead frame and method of manufacturing semiconductor device thereof | Hyung Jun Cho, Tae Yong Lee, Jae Min Bae | 2022-12-06 |
| 11417589 | Semiconductor device and a method of manufacturing a semiconductor device | Hyung Jun Cho, Tae Yong Lee, Jae Min Bae | 2022-08-16 |
| 11101540 | Semiconductor devices and methods of manufacturing semiconductor devices | Tae Yong Lee, Doo Soub Shin, Seon Ae Lee, Woo Bin Jung, Ji Yeon Ryu +1 more | 2021-08-24 |
| 11075170 | Semiconductor package with EMI shield and fabricating method thereof | Doo Soub Shin, Tae Yong Lee, Sung Gyu Kim | 2021-07-27 |
| 11018079 | Land structure for semiconductor package and method therefor | Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2021-05-25 |
| 10840169 | Semiconductor device and a method of manufacturing a semiconductor device | Hyung Jun Cho, Tae Yong Lee, Jae Min Bae | 2020-11-17 |
| 10818569 | Semiconductor device and a method of manufacturing a semiconductor device | Se Man Oh, Sang-Hyeon Lee, Min Cheol Shin | 2020-10-27 |
| 10553542 | Semiconductor package with EMI shield and fabricating method thereof | Doo Soub Shin, Tae Yong Lee, Sung Gyu Kim | 2020-02-04 |
| 10020263 | Semiconductor package and manufacturing method thereof | Tae Yong Lee, Min-Chul Shin, Se Man Oh | 2018-07-10 |
| 9911685 | Land structure for semiconductor package and method therefor | Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2018-03-06 |
| 9633932 | Lead frame package having discharge hole and method of manufacturing the same | Byong Jin Kim, Kyung Su Kim, Hyung Il Jeon, Jae Doo Kwon | 2017-04-25 |
| 9293398 | Land structure for semiconductor package and method therefor | Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2016-03-22 |
| 9129975 | Method of forming a thin substrate chip scale package device and structure | Byong Jin Kim, Gi Jeong Kim | 2015-09-08 |
| 9054089 | Lead frame package having discharge holes and method of manufacturing the same | Byong Jin Kim, Kyung Su Kim, Hyung Il Jeon, Jae Doo Kwon | 2015-06-09 |