Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388018 | Device chip scale package including a protective layer and method of manufacturing a device chip scale package | Jae Beom Shim, Seung Nam Son, Won Chul Do | 2025-08-12 |
| 12278196 | Semiconductor devices and methods of manufacturing semiconductor devices | Jae Beom Shim, Min Jae Yi, Yi Seul Han, Young Ju Lee, Kyeong Tae Kim | 2025-04-15 |
| 12010795 | Printed circuit board | Il Sik NAM, Yong Suk Kim, Dong Keun Lee, Hye Jin Jo | 2024-06-11 |
| 11990411 | Device chip scale package including a protective layer | Jae Beom Shim, Seung Nam Son, Won Chul Do | 2024-05-21 |
| 11830823 | Semiconductor devices and methods of manufacturing semiconductor devices | Jae Beom Shim, Min Jae Yi, Yi Seul Han, Young Ju Lee, Kyeong Tae Kim | 2023-11-28 |
| 11778741 | Circuit board | Yong Han JEON, Jin Seok Lee | 2023-10-03 |
| 9552999 | Packaged electronic device having reduced parasitic effects and method | Byong Jin Kim, Ji Young Chung, Gi Jeong Kim, Won Bae Bang | 2017-01-24 |
| 9431334 | Semiconductor device having single layer substrate and method | Hyung Il Jeon, Byong Jin Kim, Gi Jeong Kim, Jae Min Bae | 2016-08-30 |