JS

Jae Beom Shim

AP Amkor Technology Singapore Holding Pte.: 11 patents #23 of 289Top 8%
AT Amkor Technology: 2 patents #266 of 595Top 45%
Overall (All Time): #362,032 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
12388018 Device chip scale package including a protective layer and method of manufacturing a device chip scale package Tae Ki Kim, Seung Nam Son, Won Chul Do 2025-08-12
12288728 Semiconductor device and method of manufacturing a semiconductor device Kyeong Tae Kim, Yi Seul Han, Tae Yong Lee 2025-04-29
12278196 Semiconductor devices and methods of manufacturing semiconductor devices Tae Ki Kim, Min Jae Yi, Yi Seul Han, Young Ju Lee, Kyeong Tae Kim 2025-04-15
12261145 Semiconductor device and methods of manufacturing semiconductor devices Ji Yeon Ryu, Tai Yong LEE, Byong Jin Kim 2025-03-25
11990411 Device chip scale package including a protective layer Tae Ki Kim, Seung Nam Son, Won Chul Do 2024-05-21
11978687 Semiconductor device and method of manufacturing a semiconductor device Kyeong Tae Kim, Yi Seul Han, Tae Yong Lee 2024-05-07
11830823 Semiconductor devices and methods of manufacturing semiconductor devices Tae Ki Kim, Min Jae Yi, Yi Seul Han, Young Ju Lee, Kyeong Tae Kim 2023-11-28
11557524 Semiconductor device and method of manufacturing a semiconductor device Kyeong Tae Kim, Yi Seul Han, Tae Yong Lee 2023-01-17
11355470 Semiconductor device and methods of manufacturing semiconductor devices Ji Yeon Ryu, Tae Yong Lee, Byong Jin Kim 2022-06-07
11121077 Semiconductor device and method of manufacturing a semiconductor device Ji Yeon Ryu 2021-09-14
11018067 Semiconductor device and method of manufacturing a semiconductor device Kyeong Tae Kim, Yi Seul Han, Tae Yong Lee 2021-05-25
10141270 Semiconductor device and method of manufacturing thereof Yi Seul Han, Tae Yong Lee 2018-11-27
7977783 Wafer level chip size package having redistribution layers No Sun Park, Young Suk Chung 2011-07-12