Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131982 | Electronic package structure with reduced vertical stress regions | Tae Kyung Hwang, Eun Sook Sohn, Gi Jeong Kim | 2024-10-29 |
| 11011455 | Electronic package structure with improved board level reliability | Tae Kyung Hwang, Eun Sook Sohn, Gi Jeong Kim | 2021-05-18 |
| 9929075 | Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity | Tae Kyung Hwang, Eun Sook Sohn, Gi Jeong Kim | 2018-03-27 |
| 8026589 | Reduced profile stackable semiconductor package | Bong Chan Kim, Do Hyung Kim, Chan Ha Hwang, Min-Woo Lee, Eun Sook Sohn | 2011-09-27 |