Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334420 | Semiconductor devices and methods of manufacturing semiconductor devices | Gi Jeong Kim, Yong Ho Son, Byong Jin Kim, Jae Min Bae, Seung Woo Lee | 2025-06-17 |
| 12057378 | Semiconductor devices and methods of manufacturing semiconductor devices | Gi Jeong Kim, Byong Jin Kim, Junichiro Abe | 2024-08-06 |
| 11887916 | Semiconductor devices and methods of manufacturing semiconductor devices | Gi Jeong Kim, Yong Ho Son, Byong Jin Kim, Jae Min Bae, Seung Woo Lee | 2024-01-30 |
| 10366943 | Packaged electronic device having stepped conductive structure and related methods | Byong Jin Kim, Jia Yunn Ting | 2019-07-30 |
| 9673122 | Micro lead frame structure having reinforcing portions and method | Hyung Kook Chung, Hong-Bae Kim, Byong Jin Kim | 2017-06-06 |
| 9184118 | Micro lead frame structure having reinforcing portions and method | Hyung Kook Chung, Hong-Bae Kim, Byong Jin Kim | 2015-11-10 |