Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090228 | Semiconductor device with leadframe configured to facilitate reduced burr formation | Hong-Bae Kim, Hyun Jun Kim | 2018-10-02 |
| 9704725 | Semiconductor device with leadframe configured to facilitate reduced burr formation | Hyun Jun Kim, Hong-Bae Kim | 2017-07-11 |
| 9673122 | Micro lead frame structure having reinforcing portions and method | Hyeong Il Jeon, Hong-Bae Kim, Byong Jin Kim | 2017-06-06 |
| 9184118 | Micro lead frame structure having reinforcing portions and method | Hyeong Il Jeon, Hong-Bae Kim, Byong Jin Kim | 2015-11-10 |