Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062566 | Die ejector | Fabian Hurschler, Brian Pulis | 2024-08-13 |
| 8715457 | Method for detaching and removing a semiconductor chip from a foil | — | 2014-05-06 |
| 8133823 | Method for picking up semiconductor chips from a wafer table and method for mounting semiconductor chips on a substrate | Patrick Blessing | 2012-03-13 |
| 7066373 | Method for aligning the bondhead of a Die Bonder | — | 2006-06-27 |
| 6585145 | Die bonder and/or wire bonder with a device for holding down a substrate | Beat Zumbuehl, Reto Schubiger, Ruedi Grueter, Rolf Schuermann | 2003-07-01 |
| 6435492 | Die bonder and/or wire bonder with a suction device for pulling flat and holding down a curved substrate | Reto Schubiger, Beat Zumbuehl | 2002-08-20 |