RG

Ruedi Grueter

EA Esec Ag: 2 patents #1 of 14Top 8%
ES Esec, Trading Sa: 2 patents #7 of 43Top 20%
BA Besi Switzerland Ag: 1 patents #13 of 29Top 45%
Overall (All Time): #843,534 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9603294 Apparatus for mounting semiconductor chips Guido Suter 2017-03-21
9233389 Device for dispensing adhesive on a substrate Christof Koster, Paul Stadler 2016-01-12
8166637 Apparatus for mounting a flip chip on a substrate Patrick Blessing, Dominik Werne 2012-05-01
7597234 Method for mounting a flip chip on a substrate Patrick Blessing, Dominik Werne 2009-10-06
7020954 Apparatus for placing a semiconductor chip as a flipchip on a substrate Dominik Hartmann 2006-04-04
6585145 Die bonder and/or wire bonder with a device for holding down a substrate Stefan Behler, Beat Zumbuehl, Reto Schubiger, Rolf Schuermann 2003-07-01