Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666460 | Through type furnace for substrates comprising a longitudinal slit | Kevin Domancich, Daniel SCHERER, Reto Weibel | 2017-05-30 |
| 9603294 | Apparatus for mounting semiconductor chips | Ruedi Grueter | 2017-03-21 |
| 6820793 | Apparatus for the transport and equipping of substrates with semiconductor chips | Daniel Kellenberger | 2004-11-23 |
| 6811074 | Method and apparatus for dispensing solder on a substrate | Christoph Tschudin | 2004-11-02 |
| 6056184 | Apparatus for shaping liquid portions of solder in soft soldering semiconductor chips | Christoph B. Luchinger, Michael Lothenbach | 2000-05-02 |
| 5878939 | Method and apparatus for dispensing liquid solder | Christoph B. Luchinger | 1999-03-09 |