| 12062573 |
Method for forming barrier layer in semiconductor structure |
Peng Zhou, Shuliang Lv, Ge Mao, Rui Song |
2024-08-13 |
| 11715718 |
Bonding contacts having capping layer and method for forming the same |
Jie Pan, Shu Liang Lv, Liang Ma, Si Ping Hu, Xianjin Wan |
2023-08-01 |
| 11556107 |
Machining apparatus error correction system and method using safe, correction and alarm intervals |
Neng-Wei Chang, Tao Zeng, Hai-Jiu Wan, Bing Zhou |
2023-01-17 |
| 11537100 |
Machining error correction system and method based on key dimensional associations |
Neng-Wei Chang, Tao Zeng, Hai-Jiu Wan, Bing Zhou |
2022-12-27 |
| 11177231 |
Bonding contacts having capping layer and method for forming the same |
Jie Pan, Shu Liang Lv, Liang Ma, Si Ping Hu, Xianjin Wan |
2021-11-16 |
| 5555471 |
Method for measuring thin-film thickness and step height on the surface of thin-film/substrate test samples by phase-shifting interferometry |
Yiping Xu |
1996-09-10 |