Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715718 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Liang Ma, Yuan Li, Si Ping Hu, Xianjin Wan | 2023-08-01 |
| 11177231 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Liang Ma, Yuan Li, Si Ping Hu, Xianjin Wan | 2021-11-16 |