Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12137558 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao +6 more | 2024-11-05 |
| 12010838 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao +6 more | 2024-06-11 |
| 11996322 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Jifeng Zhu | 2024-05-28 |
| 11876049 | Bonding alignment marks at bonding interface | Meng Yan, Jia Wen Wang, Shun Hu | 2024-01-16 |
| 11791265 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2023-10-17 |
| 11715718 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Yuan Li, Xianjin Wan | 2023-08-01 |
| 11670543 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Jifeng Zhu | 2023-06-06 |
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2022-10-04 |
| 11322392 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Jifeng Zhu | 2022-05-03 |
| 11289422 | Bonding alignment marks at bonding in interface | Meng Yan, Jia Wen Wang, Shun Hu | 2022-03-29 |
| 11276642 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2022-03-15 |
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2021-12-21 |
| 11177231 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Yuan Li, Xianjin Wan | 2021-11-16 |
| 11145666 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao +6 more | 2021-10-12 |
| 11101276 | Word line contact structure for three-dimensional memory devices and fabrication methods thereof | Jifeng Zhu, Zhenyu Lu, Jun Chen, Xiaowang Dai, Lan Yao +4 more | 2021-08-24 |
| 11056387 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2021-07-06 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2021-06-29 |
| 10796993 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2020-10-06 |
| 10763158 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Jifeng Zhu | 2020-09-01 |
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2020-08-18 |
| 10679941 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2020-06-09 |
| 10680003 | Staircase structure for memory device | Zhenyu Lu, Jun Chen, Xiaowang Dai, Jifeng Zhu, Qian Tao +6 more | 2020-06-09 |
| 10672711 | Word line contact structure for three-dimensional memory devices and fabrication methods thereof | Jifeng Zhu, Zhenyu Lu, Jun Chen, Xiaowang Dai, Lan Yao +4 more | 2020-06-02 |
| 10651087 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2020-05-12 |
| 10607887 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2020-03-31 |