Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402309 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Wei Liu | 2025-08-26 |
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2022-10-04 |
| 11348936 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Wei Liu | 2022-05-31 |
| 11342352 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Wei Liu | 2022-05-24 |
| 11270770 | Local word line driver device, memory device, and fabrication method thereof | Cheng Gan, Wei Liu, Shunfu Chen | 2022-03-08 |
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2021-12-21 |
| 11094714 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Wei Liu | 2021-08-17 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2021-06-29 |
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2020-08-18 |