Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876049 | Bonding alignment marks at bonding interface | Meng Yan, Si Ping Hu, Shun Hu | 2024-01-16 |
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2022-10-04 |
| 11342185 | Wafer bonding method and structure thereof | Shuai Guo, Tao Ding, Rui Xing, Xiao Jin Wang, Jia Wang +1 more | 2022-05-24 |
| 11289422 | Bonding alignment marks at bonding in interface | Meng Yan, Si Ping Hu, Shun Hu | 2022-03-29 |
| 11205619 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2021-12-21 |
| 11049834 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2021-06-29 |
| 10748851 | Hybrid bonding using dummy bonding contacts and dummy interconnects | Tao Wang, Si Ping Hu, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2020-08-18 |
| 10679854 | Wafer bonding method and structure thereof | Shuai Guo, Tao Ding, Rui Xing, Xiao Jin Wang, Jia Wang +1 more | 2020-06-09 |
| 10580788 | Methods for forming three-dimensional memory devices | Jifeng Zhu, Jun Chen, Zhenyu Lu, Qian Tao, Si Ping Hu +1 more | 2020-03-03 |