Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device including leadframe with a combination of leads and lands and method

Semiconductor device including leadframe with a combination of leads and lands and method

US Patent 9631481 · Granted Apr 25, 2017

Estimated economic value: $6,439,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor device including heat sink with exposed side from encapsulant and 2025
Semiconductor device and methods of manufacturing semiconductor devices2025
Semiconductor device and manufacturing method thereof2025
Semiconductor devices having a plurality of offsets in leads supporting stacked 2024
Semiconductor package having routable encapsulated conductive substrate and meth2024
Semiconductor package having routable encapsulated conductive substrate and meth2024
Packaged electronic device having integrated antenna and locking structure2024