Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of forming a molded substrate electronic package and structure

Method of forming a molded substrate electronic package and structure

US Patent 10910298 · Granted Feb 2, 2021

Estimated economic value: $26,749,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor device with redistribution layers formed utilizing dummy substrate2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor devices and methods of manufacturing semiconductor devices2025
Semiconductor device and methods of manufacturing semiconductor devices2025
Semiconductor device and manufacturing method thereof2025
Electronic sensor devices and methods of manufacturing electronic sensor devices2024
Electronic package structure with reduced vertical stress regions2024
Semiconductor device with a semiconductor die embedded between an extended subst2024
Semiconductor package having routable encapsulated conductive substrate and meth2024