Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12187603 | Semiconductor package using a polymer substrate | Yung Woo Lee, Byung-jun Kim, Dong Hyun Bang, Adrian Arcedera, Jae Ung Lee | 2025-01-07 |
| 12009289 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more | 2024-06-11 |
| 11855000 | Semiconductor device having EMI shielding structure and related methods | Young Woo Lee, Jae Ung Lee, Byong Jin Kim, Ji Hoon Oh, Young Seok Kim +4 more | 2023-12-26 |
| 11572269 | Semiconductor package using a polymer substrate | Yung Woo Lee, Byung-jun Kim, Dong Hyun Bang, Adrian Arcedera, Jae Ung Lee | 2023-02-07 |
| 11355449 | Semiconductor device having EMI shielding structure and related methods | Young Woo Lee, Jae Ung Lee, Byong Jin Kim, Ji Hoon Oh, Young Seok Kim +4 more | 2022-06-07 |
| 11152296 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more | 2021-10-19 |
| 10822226 | Semiconductor package using a polymer substrate | Yung Woo Lee, Byung-jun Kim, Dong Hyun Bang, Adrian Arcedera, Jae Ung Lee | 2020-11-03 |
| 10144634 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo +2 more | 2018-12-04 |
| 10032705 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more | 2018-07-24 |
| 9809446 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo +2 more | 2017-11-07 |
| 9056765 | Semiconductor package and manufacturing method thereof | Jong Dae Jung, Dong Hyun Bang, Yung Woo Lee, Byung-jun Kim | 2015-06-16 |
| 9018741 | Semiconductor package and manufacturing method thereof | Dong In Kim, Jae Ung Lee, Min Ju Kim | 2015-04-28 |