Issued Patents All Time
Showing 26–50 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224218 | Method for fabricating semiconductor package having a multi-layer encapsulated conductive substrate and structure | Won Bae Bang, Gi Jeong Kim, Ji Young Chung | 2019-03-05 |
| 10177117 | Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure | Won Bae Bang, Ju Hoon Yoon, Ji Young Chung, Gi Jeong Kim, Choon Heung Lee | 2019-01-08 |
| 10144634 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee +2 more | 2018-12-04 |
| 10049954 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2018-08-14 |
| 10032705 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Yung Woo Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi +5 more | 2018-07-24 |
| 9978695 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Won Bae Bang | 2018-05-22 |
| 9966652 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Gi Jeong Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2018-05-08 |
| 9922919 | Electronic package structure having insulated substrate with lands and conductive patterns | Won Bae Bang, Gi Jeong Kim, Ji Young Chung | 2018-03-20 |
| 9911685 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2018-03-06 |
| 9881864 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2018-01-30 |
| 9871011 | Semiconductor package using a contact in a pleated sidewall encapsulant opening | Jae Yun Kim, Tae Kyung Hwang, Jin Han Kim, Jong Sik Paek, Kyoung Rock Kim +1 more | 2018-01-16 |
| 9809446 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Young Seok Kim, Wook Choi, Seung Jae Yoo, Yung Woo Lee +2 more | 2017-11-07 |
| 9716071 | Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening | Ji Yeon Ryu, Jae Beum Shim | 2017-07-25 |
| 9704747 | Semiconductor device and manufacturing method thereof | Ji Yeon Ryu, Jae Beum Shim | 2017-07-11 |
| 9673122 | Micro lead frame structure having reinforcing portions and method | Hyeong Il Jeon, Hyung Kook Chung, Hong-Bae Kim | 2017-06-06 |
| 9653336 | Semiconductor device and manufacturing method thereof | Yi Seul Han, Jae Beum Shim, In Bae Park | 2017-05-16 |
| 9631481 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Won Bae Bang | 2017-04-25 |
| 9633932 | Lead frame package having discharge hole and method of manufacturing the same | Kyoung Yeon Lee, Kyung Su Kim, Hyung Il Jeon, Jae Doo Kwon | 2017-04-25 |
| 9613829 | Method for fabricating semiconductor package and semiconductor package using the same | Seung Woo Lee, Won Bae Bang, Sang Goo Kang | 2017-04-04 |
| 9552999 | Packaged electronic device having reduced parasitic effects and method | Tae Ki Kim, Ji Young Chung, Gi Jeong Kim, Won Bae Bang | 2017-01-24 |
| 9543235 | Semiconductor package and method therefor | Hyung Il Jeon, Ji Young Chung, In Bae Park, Jae Min Bae, No Sun Park | 2017-01-10 |
| 9513254 | Microfluidic sensor package structure and method | Hyung-II Jeon, Ji Young Chung, Chan Ha Hwang, Yung Woo Lee, Do Hyun Na +1 more | 2016-12-06 |
| 9508631 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Won Bae Bang | 2016-11-29 |
| 9431334 | Semiconductor device having single layer substrate and method | Hyung Il Jeon, Gi Jeong Kim, Jae Min Bae, Tae Ki Kim | 2016-08-30 |
| 9412729 | Semiconductor package and fabricating method thereof | Ji Young Chung, Choon Heung Lee, Glenn Rinne | 2016-08-09 |