Issued Patents All Time
Showing 51–63 of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9293398 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2016-03-22 |
| 9275939 | Semiconductor device including leadframe with a combination of leads and lands and method | Jae Min Bae, Won Bae Bang | 2016-03-01 |
| 9184118 | Micro lead frame structure having reinforcing portions and method | Hyeong Il Jeon, Hyung Kook Chung, Hong-Bae Kim | 2015-11-10 |
| 9184148 | Semiconductor package and method therefor | Hyung Il Jeon, Ji Young Chung, In Bae Park, Jae Min Bae, No Sun Park | 2015-11-10 |
| 9171812 | Semiconductor device having conductive pads with neck-down portions to prevent solder reflow | Min-Chul Shin, Ho Choi | 2015-10-27 |
| 9129975 | Method of forming a thin substrate chip scale package device and structure | Kyoung Yeon Lee, Gi Jeong Kim | 2015-09-08 |
| 9054089 | Lead frame package having discharge holes and method of manufacturing the same | Kyoung Yeon Lee, Kyung Su Kim, Hyung Il Jeon, Jae Doo Kwon | 2015-06-09 |
| 9029992 | Electronic package structure with insulated adhesion portion for affixing and isolating lands spaced apart from land connect bar within a leadframe | Sung Gyu Kim, Gi Jeong Kim | 2015-05-12 |
| 8921955 | Semiconductor device with micro electromechanical system die | Jae Ung Lee, Hyung Il Jeon, Eun Jung Jo, Koo Woong Jeong | 2014-12-30 |
| 8866278 | Semiconductor device with increased I/O configuration | Jae Min Bae, Hyng II Jeon, Yoon Ki Namkung | 2014-10-21 |
| 8648450 | Semiconductor device including leadframe with a combination of leads and lands | Jae Min Bae, Won Bae Bang | 2014-02-11 |
| 8604625 | Semiconductor device having conductive pads to prevent solder reflow | Min-Chul Shin, Ho Choi | 2013-12-10 |
| 8487420 | Package in package semiconductor device with film over wire | Chan Ha Hwang, Eun Sook Sohn, Ho Choi, Ji-Yeon YU, Min-Woo Lee | 2013-07-16 |