Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12230586 | Printed circuit board and electronic component package including the same | — | 2025-02-18 |
| 11948849 | Package-embedded board | — | 2024-04-02 |
| 11715680 | Printed circuit board | — | 2023-08-01 |
| 11439021 | Electronic component-embedded substrate | Kyung Hwan Ko, Jung-Hyun Cho, Chang Soo Woo, Soon Cheol Jung | 2022-09-06 |
| 8921955 | Semiconductor device with micro electromechanical system die | Jae Ung Lee, Byong Jin Kim, Hyung Il Jeon, Eun Jung Jo | 2014-12-30 |