Issued Patents All Time
Showing 26–32 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8207022 | Exposed die overmolded flip chip package method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2012-06-26 |
| 7898093 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2011-03-01 |
| 6589801 | Wafer-scale production of chip-scale semiconductor packages using wafer mapping techniques | Dae Byung Kang, In Bae Park, Vincent DiCaprio, Markus K. Liebhard | 2003-07-08 |
| 6479887 | Circuit pattern tape for wafer-scale production of chip size semiconductor packages | Dae Byung Kang | 2002-11-12 |
| 6428641 | Method for laminating circuit pattern tape on semiconductor wafer | Woo-Hyun Kong, Chang-Bok Lee, Sung Jin Yang | 2002-08-06 |
| 6150709 | Grid array type lead frame having lead ends in different planes | Won Sun Shin, Byung Joon Han, Sung Bum Kwak, In Gyu Han | 2000-11-21 |
| 5866939 | Lead end grid array semiconductor package | Won Sun Shin, Byung Joon Han, Sung Bum Kwak, In Gyu Han | 1999-02-02 |