Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7306133 | System for fabricating an integrated circuit package on a printed circuit board | Yonggang Jin, Puay Gek Chua, Won Sun Shin | 2007-12-11 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7306133 | System for fabricating an integrated circuit package on a printed circuit board | Yonggang Jin, Puay Gek Chua, Won Sun Shin | 2007-12-11 |