Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8535980 | Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package | Yonggang Jin | 2013-09-17 |
| 7306133 | System for fabricating an integrated circuit package on a printed circuit board | Yonggang Jin, Shelley Yong, Won Sun Shin | 2007-12-11 |