Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8314480 | Stackable semiconductor package with embedded die in pre-molded carrier frame | Leocadio Morona Alabin, In-Suk Kim | 2012-11-20 |
| 8198132 | Isolated stacked die semiconductor packages | Leocadio Morona Alabin | 2012-06-12 |
| 8072051 | Folded lands and vias for multichip semiconductor packages | Leocadio Morona Alabin, In-Suk Kim | 2011-12-06 |
| 8053883 | Isolated stacked die semiconductor packages | Leocadio Morona Alabin | 2011-11-08 |
| 7977776 | Multichip discrete package | Leocadio Morona Alabin | 2011-07-12 |
| 7960211 | Semiconductor system-in-package and method for making the same | Leocadio Morona Alabin | 2011-06-14 |
| 7944031 | Leadframe-based chip scale semiconductor packages | Leocadio Morona Alabin | 2011-05-17 |
| 7923847 | Semiconductor system-in-a-package containing micro-layered lead frame | Leocadio Morona Alabin | 2011-04-12 |
| 7888781 | Micro-layered lead frame semiconductor packages | Leocadio Morona Alabin | 2011-02-15 |
| 7846773 | Multi-chip semiconductor package | Leocadio Morona Alabin | 2010-12-07 |
| 7843048 | Multi-chip discrete devices in semiconductor packages | Leocadio Morona Alabin | 2010-11-30 |