Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057434 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2024-08-06 |
| 11488934 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2022-11-01 |
| 10872879 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2020-12-22 |
| 10163867 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2018-12-25 |
| 9025301 | Wire fence fingerprint sensor package and fabrication method | — | 2015-05-05 |
| 5861076 | Method for making multi-layer circuit boards | Sukianto Rusli, Jordan L. Wahl, Tayfun Ilercil, Robert Forcier, Jerome S. Sallo | 1999-01-19 |