Robert Lanzone — 10 Patents at Amkor Technology

Robert Lanzone has been granted 10 US patents while listed as an inventor at Amkor Technology. The first was granted in 2013 and the most recent in August 2024. Robert Lanzone ranks #481,000 of 4,157,543 US inventors in our database (top 11.6%). Patent records list Robert Lanzone in Chandler, AZ, US.

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12057434	Semiconductor package and manufacturing method thereof	Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more	2024-08-06	$37,572,000
11488934	Semiconductor package and manufacturing method thereof	Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more	2022-11-01	$23,599,000
10872879	Semiconductor package and manufacturing method thereof	Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more	2020-12-22	$47,091,000
10163867	Semiconductor package and manufacturing method thereof	Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more	2018-12-25
9875980	Copper pillar sidewall protection	Glenn Rinne, Dean Zehnder, Christopher J. Berry, Ludovico E. Bancod	2018-01-23	$17,896,000
9245862	Electronic component package fabrication method and structure	Sundeep Nand Nangalia, Richard Raymond Green, Dean Zehnder, Riki Whiting	2016-01-26	$16,257,000
8969192	Low stress substrate and formation method	—	2015-03-03	$26,968,000
8664090	Electronic component package fabrication method	Sundeep Nand Nangalia, Richard Raymond Green, Dean Zehnder	2014-03-04	$7,739,000
8564114	Semiconductor package thermal tape window frame for heat sink attachment	—	2013-10-22	$6,327,000
8552557	Electronic component package fabrication method and structure	Sundeep Nand Nangalia, Richard Raymond Green, Ravi Kiran Chilukuri, Rex Anderson	2013-10-08	$987,000

Robert Lanzone — 10 Patents

Issued Patents All Time

Patent Widget