Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057434 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more | 2024-08-06 |
| 11488934 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more | 2022-11-01 |
| 10872879 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more | 2020-12-22 |
| 10163867 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Jae Ung Lee +2 more | 2018-12-25 |
| 9875980 | Copper pillar sidewall protection | Glenn Rinne, Dean Zehnder, Christopher J. Berry, Ludovico E. Bancod | 2018-01-23 |
| 9245862 | Electronic component package fabrication method and structure | Sundeep Nand Nangalia, Richard Raymond Green, Dean Zehnder, Riki Whiting | 2016-01-26 |
| 8969192 | Low stress substrate and formation method | — | 2015-03-03 |
| 8664090 | Electronic component package fabrication method | Sundeep Nand Nangalia, Richard Raymond Green, Dean Zehnder | 2014-03-04 |
| 8564114 | Semiconductor package thermal tape window frame for heat sink attachment | — | 2013-10-22 |
| 8552557 | Electronic component package fabrication method and structure | Sundeep Nand Nangalia, Richard Raymond Green, Ravi Kiran Chilukuri, Rex Anderson | 2013-10-08 |