Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8552557 | Electronic component package fabrication method and structure | Sundeep Nand Nangalia, Richard Raymond Green, Robert Lanzone, Rex Anderson | 2013-10-08 |
| 8426966 | Bumped chip package | Ronald Patrick Huemoeller, Rex Anderson | 2013-04-23 |
| 8263486 | Bumped chip package fabrication method and structure | Ronald Patrick Huemoeller, Rex Anderson | 2012-09-11 |
| 7994045 | Bumped chip package fabrication method and structure | Ronald Patrick Huemoeller, Rex Anderson | 2011-08-09 |