Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10941495 | Additive metal deposition process | Scott Volk, Jerry Rushak, Peter Engel | 2021-03-09 |
| 9920433 | Additive metal deposition process | Scott Volk, Jerry Rushak, Peter Engel | 2018-03-20 |
| 8643177 | Wafers including patterned back side layers thereon | Glenn Rinne, Julia Roe, Christopher J. Berry | 2014-02-04 |
| 7871899 | Methods of forming back side layers for thinned wafers | Glenn Rinne, Julia Roe, Chirstopher John Berry | 2011-01-18 |
| 7665652 | Electronic devices including metallurgy structures for wire and solder bonding | J. Daniel Mis | 2010-02-23 |
| 6762122 | Methods of forming metallurgy structures for wire and solder bonding | J. Daniel Mis | 2004-07-13 |