Issued Patents All Time
Showing 51–70 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7851894 | System and method for shielding of package on package (PoP) assemblies | — | 2010-12-14 |
| 7829990 | Stackable semiconductor package including laminate interposer | Christopher J. Berry | 2010-11-09 |
| 7825520 | Stacked redistribution layer (RDL) die assembly package | Joseph Marco Longo | 2010-11-02 |
| 7781852 | Membrane die attach circuit element package and method therefor | Faheem F. Faheem, Christopher J. Berry | 2010-08-24 |
| 7777351 | Thin stacked interposer package | Christopher J. Berry | 2010-08-17 |
| 7745910 | Semiconductor device having RF shielding and method therefor | Timothy L. Olson, Christopher J. Berry | 2010-06-29 |
| 7732899 | Etch singulated semiconductor package | Christopher J. Berry, Faheem F. Faheem | 2010-06-08 |
| 7633765 | Semiconductor package including a top-surface metal layer for implementing circuit features | Ronald Patrick Huemoeller | 2009-12-15 |
| 7550857 | Stacked redistribution layer (RDL) die assembly package | Joseph Marco Longo | 2009-06-23 |
| 7507603 | Etch singulated semiconductor package | Christopher J. Berry, Faheem F. Faheem | 2009-03-24 |
| 7342303 | Semiconductor device having RF shielding and method therefor | Christopher J. Berry | 2008-03-11 |
| 7049682 | Multi-chip semiconductor package with integral shield and antenna | Douglas J. Mathews, Robert J. Hill, Michael P. Gaynor, Ronald James Schoonejongen, John Armando Miranda | 2006-05-23 |
| 6686649 | Multi-chip semiconductor package with integral shield and antenna | Douglas J. Mathews, Robert J. Hill, Michael P. Gaynor, Ronald James Schoonejongen, John Armando Miranda | 2004-02-03 |
| 6546620 | Flip chip integrated circuit and passive chip component package fabrication method | Frank J. Juskey, Pat O'Brien | 2003-04-15 |
| 6494361 | Semiconductor module package substrate fabrication method | Jon Aday | 2002-12-17 |
| 6445075 | Semiconductor module package substrate | Jon Aday | 2002-09-03 |
| 6356453 | Electronic package having flip chip integrated circuit and passive chip component | Frank J. Juskey, Pat O'Brien | 2002-03-12 |
| 5898128 | Electronic component | Guillermo L. Romero, David M. Gilbert | 1999-04-27 |
| 5786097 | Assembly substrate and method of making | — | 1998-07-28 |
| 5751552 | Semiconductor device balancing thermal expansion coefficient mismatch | Carl Raleigh | 1998-05-12 |