Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9003649 | Method of making a two-sided fluid cooled assembly | Joe L. Martinez, Jr. | 2015-04-14 |
| 8966759 | Method of making a fluid cooled assembly | Joe L. Martinez, Jr. | 2015-03-03 |
| 8698302 | Power switching assembly having a robust gate connection | Lawrence E. Rinehart | 2014-04-15 |
| 8089150 | Structurally robust power switching assembly | Lawrence E. Rinehart | 2012-01-03 |
| 7522403 | High current-load film capacitor assembly | Lawrence E. Rinehart | 2009-04-21 |
| 7521789 | Electrical assembly having heat sink protrusions | Lawrence E. Rinehart | 2009-04-21 |
| 7197819 | Method of assembling an electric power | Lawrence E. Rinehart | 2007-04-03 |
| 7173823 | Fluid cooled electrical assembly | Lawrence E. Rinehart | 2007-02-06 |
| 5915463 | Heat dissipation apparatus and method | Tien-Yu Lee | 1999-06-29 |
| 5898128 | Electronic component | Christopher M. Scanlan, David M. Gilbert | 1999-04-27 |
| 5786230 | Method of fabricating multi-chip packages | Samuel J. Anderson | 1998-07-28 |
| 5666269 | Metal matrix composite power dissipation apparatus | Samuel J. Anderson, Brent W. Pinder | 1997-09-09 |
| 5616886 | Wirebondless module package | Samuel J. Anderson | 1997-04-01 |
| 5565705 | Electronic module for removing heat from a semiconductor die | Joe L. Martinez, Jr. | 1996-10-15 |
| 5544412 | Method for coupling a power lead to a bond pad in an electronic module | Joe L. Martinez, Jr. | 1996-08-13 |
| 5533257 | Method for forming a heat dissipation apparatus | Joe L. Martinez, Jr. | 1996-07-09 |
| 5508559 | Power circuit package | Samuel J. Anderson | 1996-04-16 |
| 5480727 | Electronic device assembly and method for making | Brent W. Pinder | 1996-01-02 |
| 5465481 | Method for fabricating a semiconductor package | — | 1995-11-14 |
| 5440787 | Clasp for cloth neckwear and the like | Raul D. Figueroa | 1995-08-15 |
| 5371043 | Method for forming a power circuit package | Samuel J. Anderson | 1994-12-06 |