Issued Patents All Time
Showing 26–50 of 70 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9401313 | Automated optical inspection of unit specific patterning | Craig Bishop, Vaibhav Joga Singh Bora, Timothy L. Olson | 2016-07-26 |
| 9397069 | Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping | Craig Bishop | 2016-07-19 |
| 9337086 | Die up fully molded fan-out wafer level packaging | — | 2016-05-10 |
| 9269622 | Semiconductor device and method of land grid array packaging with bussing lines | Timothy L. Olson | 2016-02-23 |
| 9196509 | Semiconductor device and method of adaptive patterning for panelized packaging | Timothy L. Olson | 2015-11-24 |
| 9177926 | Semiconductor device and method comprising thickened redistribution layers | Craig Bishop | 2015-11-03 |
| 9040316 | Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping | Craig Bishop | 2015-05-26 |
| 8922021 | Die up fully molded fan-out wafer level packaging | — | 2014-12-30 |
| 8835230 | Fully molded fan-out | — | 2014-09-16 |
| 8826221 | Adaptive patterning for panelized packaging | Timothy L. Olson | 2014-09-02 |
| 8796561 | Fan out build up substrate stackable package and method | Roger D. St. Amand, Jae Dong Kim | 2014-08-05 |
| 8799845 | Adaptive patterning for panelized packaging | Timothy L. Olson | 2014-08-05 |
| 8656333 | Integrated circuit package auto-routing | Craig Bishop, Tim Olson | 2014-02-18 |
| 8629546 | Stacked redistribution layer (RDL) die assembly package | — | 2014-01-14 |
| 8604600 | Fully molded fan-out | — | 2013-12-10 |
| 8535978 | Die up fully molded fan-out wafer level packaging | — | 2013-09-17 |
| 8319338 | Thin stacked interposer package | Christopher J. Berry | 2012-11-27 |
| 8299610 | Semiconductor device having RF shielding and method therefor | Christopher J. Berry | 2012-10-30 |
| 8227338 | Semiconductor package including a top-surface metal layer for implementing circuit features | Ronald Patrick Huemoeller | 2012-07-24 |
| 8203203 | Stacked redistribution layer (RDL) die assembly package | — | 2012-06-19 |
| 8093691 | System and method for RF shielding of a semiconductor package | Ruben Fuentes, Jong Ok Chun | 2012-01-10 |
| 8018068 | Semiconductor package including a top-surface metal layer for implementing circuit features | Ronald Patrick Huemoeller | 2011-09-13 |
| 7960827 | Thermal via heat spreader package and method | August Joseph Miller, Jr., Jeffrey Alan Miks, Mahmoud Dreiza | 2011-06-14 |
| 7898066 | Semiconductor device having EMI shielding and method therefor | Christopher J. Berry, Timothy L. Olson | 2011-03-01 |
| 7859116 | Exposed metal bezel for use in sensor devices and method therefor | Michael Kelly, Christopher J. Berry | 2010-12-28 |