Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9346668 | Molded cavity substrate MEMS package fabrication method and structure | Mahmoud Dreiza, Russell Shumway | 2016-05-24 | $5,703,000 |
| 9029962 | Molded cavity substrate MEMS package fabrication method and structure | Mahmoud Dreiza, Russell Shumway | 2015-05-12 | $9,460,000 |