Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12306434 | Photonic wafer communication systems and related packages | Carl Ramey, Jon Elmhurst, Darius Bunandar, Nicholas C. Harris | 2025-05-20 |
| 11947164 | Photonic wafer communication systems and related packages | Carl Ramey, Jon Elmhurst, Darius Bunandar, Nicholas C. Harris | 2024-04-02 |
| 11256029 | Photonics packaging method and device | Carl Ramey, Michael Gould, Nicholas C. Harris | 2022-02-22 |
| 10775429 | Testing monolithic three dimensional integrated circuits | Abhishek Koneru, Krishnendu Chakrabarty | 2020-09-15 |
| 10636776 | Methods of manufacturing RF filters | Md. Sayed Kaysar Bin Rahim, Luke England | 2020-04-28 |
| 10236263 | Methods and structures for mitigating ESD during wafer bonding | Luke England, Tanya A. Atanasova, Daniel M. Smith, Daniel W. Fisher | 2019-03-19 |
| 10083958 | Deep trench metal-insulator-metal capacitors | Somnath Ghosh, Daniel M. Smith, Luke England | 2018-09-25 |
| 10069490 | Method, apparatus and system for voltage compensation in a semiconductor wafer | Luke England, Mehdi Sadi | 2018-09-04 |
| 9716487 | Latency compensation network using timing slack sensors | Luke England, Mehdi Sadi | 2017-07-25 |
| 9460975 | DFT structure for TSVs in 3D ICs while maintaining functional purpose | Xiaoqiang Zhang, Shan Gao | 2016-10-04 |
| 9401312 | TSV redundancy scheme and architecture using decoder/encoder | Kaushal Kannan | 2016-07-26 |
| 8742777 | Method and system for testing an electric circuit | Bruce Kim, Ganesh Srinivasan, Friedrich Taenzler | 2014-06-03 |