Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8580672 | Methods of forming bump structures that include a protection layer | Frank Kuechenmeister, Lothar Lehmann, Gotthard Jungnickel, Sven Kosgalwies | 2013-11-12 | $1,972,000 |
| 8039958 | Semiconductor device including a reduced stress configuration for metal pillars | Matthias Lehr, Frank Kuechenmeister | 2011-10-18 | $1,986,000 |
| 7829453 | Method for forming solder balls with a stable oxide layer by controlling the reflow ambient | Gotthard Jungnickel, Frank Kuechenmeister | 2010-11-09 | $4,649,000 |
| 7585759 | Technique for efficiently patterning an underbump metallization layer using a dry etch process | Frank Kuechenmeister, Gotthard Jungnickel, Kerstin Siury | 2009-09-08 | $20,470,000 |