Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods of forming bump structures that include a protection layer

Methods of forming bump structures that include a protection layer

US Patent 8580672 · Granted Nov 12, 2013

Estimated economic value: $1,972,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Crackstop structures2025
Chip module structure and method and system for chip module design using chip-pa2024
Crackstop with embedded passive radio frequency noise suppressor and method2023
Chip module with robust in-package interconnects2023
Barrier structure with passage for waveguide in photonic integrated circuit2023
Crackstop structures2023
Integrated circuit structure with dielectric material to cover horizontally sepa2023
Photonics chips with an edge coupler and a continuous crackstop2023
Electronic control unit for operating an electric motor having a braking resisto2021
Articles including bonded metal structures and methods of preparing the same2017
Semiconductor dies with reduced area consumption2016
Stacked semiconductor chips packaging2016