Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and system for packing optimization of semiconductor devices

Method and system for packing optimization of semiconductor devices

US Patent 11239192 · Granted Feb 1, 2022

Estimated economic value: $57,452,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device using EMC wafer support system and fabricating method there2025
Semiconductor device and manufacturing method thereof2025
Electronic device with top side pin array and manufacturing method thereof2025
Electronic device with top side pin array and manufacturing method thereof2025
Method and system for packing optimization of semiconductor devices2024
Method and system for packing optimization of semiconductor devices2024
Semiconductor device and manufacturing method thereof2024
Displays with embedded light emitters2023
Displays with unpatterned layers of light-absorbing material2023
Surface-mountable pixel packages and pixel engines2023
Surface-mountable pixel packages and pixel engines2023
Apparatus and method for post-processing an audio signal using prediction based 2023