| 10367074 |
Method of forming vias in silicon carbide and resulting devices and circuits |
Zoltan Ring, Scott Sheppard |
2019-07-30 |
$55,513,000 |
| 10090394 |
Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features |
Jason Gurganus |
2018-10-02 |
$16,061,000 |
| 10020244 |
Polymer via plugs with high thermal integrity |
Van Mieczkowski, William T. Pulz |
2018-07-10 |
$12,952,000 |
| 9812338 |
Encapsulation of advanced devices using novel PECVD and ALD schemes |
Zoltan Ring, Daniel Namishia |
2017-11-07 |
$8,789,000 |
| 9640623 |
Semiconductor device with improved field plate |
— |
2017-05-02 |
$1,476,000 |
| 9640627 |
Schottky contact |
Saptharishi Sriram |
2017-05-02 |
$1,476,000 |
| 9607955 |
Contact pad |
Van Mieczkowski, Zoltan Ring, Jason Gurganus |
2017-03-28 |
$1,748,000 |
| 9608078 |
Semiconductor device with improved field plate |
Fabian Radulescu, Saptharishi Sriram, Daniel Etter |
2017-03-28 |
$1,748,000 |
| 9548206 |
Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features |
Jason Gurganus |
2017-01-17 |
$5,854,000 |
| 9536783 |
Wafer-level die attach metallization |
Fabian Radulescu, Terry Alcorn, William T. Pulz, Van Mieczkowski |
2017-01-03 |
$2,515,000 |
| 9490169 |
Method of forming vias in silicon carbide and resulting devices and circuits |
Zoltan Ring, Scott Sheppard |
2016-11-08 |
$2,091,000 |
| 9343543 |
Gate contact for a semiconductor device and methods of fabrication thereof |
Fabian Radulescu |
2016-05-17 |
$3,004,000 |
| 9269662 |
Using stress reduction barrier sub-layers in a semiconductor die |
Zoltan Ring, Daniel Namishia, Fabian Radulescu |
2016-02-23 |
$13,050,000 |
| 9214352 |
Ohmic contact to semiconductor device |
Daniel Namishia |
2015-12-15 |
$3,174,000 |
| 9202703 |
Ni-rich Schottky contact |
Fabian Radulescu, Daniel Namishia |
2015-12-01 |
$4,871,000 |
| 9142631 |
Multilayer diffusion barriers for wide bandgap Schottky barrier devices |
Van Mieczkowski, Zoltan Ring |
2015-09-22 |
$2,694,000 |
| 8994073 |
Hydrogen mitigation schemes in the passivation of advanced devices |
Zoltan Ring |
2015-03-31 |
$8,588,000 |
| 8994182 |
Dielectric solder barrier for semiconductor devices |
Fabian Radulescu |
2015-03-31 |
$8,588,000 |
| 8970010 |
Wafer-level die attach metallization |
Fabian Radulescu, Terry Alcorn, William T. Pulz |
2015-03-03 |
$8,002,000 |
| 8969927 |
Gate contact for a semiconductor device and methods of fabrication thereof |
Fabian Radulescu |
2015-03-03 |
$8,002,000 |
| 8907350 |
Semiconductor devices having improved adhesion and methods of fabricating the same |
Van Mieczkowski |
2014-12-09 |
$8,413,000 |
| 8896122 |
Semiconductor devices having gates including oxidized nickel |
Van Mieczkowski, Kevin Haberern |
2014-11-25 |
$5,647,000 |
| 8563372 |
Methods of forming contact structures including alternating metal and silicon layers and related devices |
Zoltan Ring, Scott Sheppard, Jason Henning, Jason Gurganus, Dan Namishia |
2013-10-22 |
$9,185,000 |
| 8202796 |
Method of forming vias in silicon carbide and resulting devices and circuits |
Zoltan Ring, Scott Sheppard |
2012-06-19 |
$8,258,000 |
| 8138583 |
Diode having reduced on-resistance and associated method of manufacture |
Saptharishi Sriram, Thomas J. Smith |
2012-03-20 |
$14,625,000 |