Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10367074 | Method of forming vias in silicon carbide and resulting devices and circuits | Zoltan Ring, Scott Sheppard | 2019-07-30 |
| 10090394 | Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features | Jason Gurganus | 2018-10-02 |
| 10020244 | Polymer via plugs with high thermal integrity | Van Mieczkowski, William T. Pulz | 2018-07-10 |
| 9812338 | Encapsulation of advanced devices using novel PECVD and ALD schemes | Zoltan Ring, Daniel Namishia | 2017-11-07 |
| 9640623 | Semiconductor device with improved field plate | — | 2017-05-02 |
| 9640627 | Schottky contact | Saptharishi Sriram | 2017-05-02 |
| 9607955 | Contact pad | Van Mieczkowski, Zoltan Ring, Jason Gurganus | 2017-03-28 |
| 9608078 | Semiconductor device with improved field plate | Fabian Radulescu, Saptharishi Sriram, Daniel Etter | 2017-03-28 |
| 9548206 | Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features | Jason Gurganus | 2017-01-17 |
| 9536783 | Wafer-level die attach metallization | Fabian Radulescu, Terry Alcorn, William T. Pulz, Van Mieczkowski | 2017-01-03 |
| 9490169 | Method of forming vias in silicon carbide and resulting devices and circuits | Zoltan Ring, Scott Sheppard | 2016-11-08 |
| 9343543 | Gate contact for a semiconductor device and methods of fabrication thereof | Fabian Radulescu | 2016-05-17 |
| 9269662 | Using stress reduction barrier sub-layers in a semiconductor die | Zoltan Ring, Daniel Namishia, Fabian Radulescu | 2016-02-23 |
| 9214352 | Ohmic contact to semiconductor device | Daniel Namishia | 2015-12-15 |
| 9202703 | Ni-rich Schottky contact | Fabian Radulescu, Daniel Namishia | 2015-12-01 |
| 9142631 | Multilayer diffusion barriers for wide bandgap Schottky barrier devices | Van Mieczkowski, Zoltan Ring | 2015-09-22 |
| 8994073 | Hydrogen mitigation schemes in the passivation of advanced devices | Zoltan Ring | 2015-03-31 |
| 8994182 | Dielectric solder barrier for semiconductor devices | Fabian Radulescu | 2015-03-31 |
| 8970010 | Wafer-level die attach metallization | Fabian Radulescu, Terry Alcorn, William T. Pulz | 2015-03-03 |
| 8969927 | Gate contact for a semiconductor device and methods of fabrication thereof | Fabian Radulescu | 2015-03-03 |
| 8907350 | Semiconductor devices having improved adhesion and methods of fabricating the same | Van Mieczkowski | 2014-12-09 |
| 8896122 | Semiconductor devices having gates including oxidized nickel | Van Mieczkowski, Kevin Haberern | 2014-11-25 |
| 8563372 | Methods of forming contact structures including alternating metal and silicon layers and related devices | Zoltan Ring, Scott Sheppard, Jason Henning, Jason Gurganus, Dan Namishia | 2013-10-22 |
| 8202796 | Method of forming vias in silicon carbide and resulting devices and circuits | Zoltan Ring, Scott Sheppard | 2012-06-19 |
| 8138583 | Diode having reduced on-resistance and associated method of manufacture | Saptharishi Sriram, Thomas J. Smith | 2012-03-20 |