Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10658307 | Control of warpage using ABF GC cavity for embedded die package | Ian En Yoon Chin, Daniel N. Sobieski | 2020-05-19 | $31,576,000 |
| 9941219 | Control of warpage using ABF GC cavity for embedded die package | Ian En Yoon Chin, Daniel N. Sobieski | 2018-04-10 | $20,820,000 |