Issued Patents All Time
Showing 26–50 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7671120 | Chain extension for thermal materials | — | 2010-03-02 |
| 7666768 | Through-die metal vias with a dispersed phase of graphitic structures of carbon for reduced thermal expansion and increased electrical conductance | Nachiket R. Raravikar, Daewoong Suh, Leonel Arana | 2010-02-23 |
| 7465605 | In-situ functionalization of carbon nanotubes | Nachiket R. Raravikar | 2008-12-16 |
| 7446360 | Polymer device with a nanocomposite barrier layer | Gudbjorg H. Oskarsdottir | 2008-11-04 |
| 7421780 | Methods for fabricating thermal management systems for micro-components | Sabina J. Houle | 2008-09-09 |
| 7417111 | Liquid crystalline epoxy resins | Paul A. Koning | 2008-08-26 |
| 7408787 | Phase change thermal interface materials including polyester resin | Paul A. Koning | 2008-08-05 |
| 7365414 | Component packaging apparatus, systems, and methods | Paul A. Koning | 2008-04-29 |
| 7327027 | Thermal interface structure with integrated liquid cooling and methods | Sabina J. Houle | 2008-02-05 |
| 7179689 | Package stress management | Gudbjorg H. Oskarsdottir, Mitesh Patel | 2007-02-20 |
| 7170188 | Package stress management | Gudbjorg H. Oskarsdottir, Mitesh Patel | 2007-01-30 |
| 7126215 | Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist | Paul A. Koning | 2006-10-24 |
| 7060747 | Chain extension for thermal materials | — | 2006-06-13 |
| 7030483 | Polymer solder hybrid interface material with improved solder filler particle size and microelectronic package application | Ashay Dani | 2006-04-18 |
| 7030485 | Thermal interface structure with integrated liquid cooling and methods | Sabina J. Houle | 2006-04-18 |
| 7019971 | Thermal management systems for micro-components | Sabina J. Houle | 2006-03-28 |
| 6974723 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | Paul A. Koning, Ashay Dani, Christopher L. Rumer | 2005-12-13 |
| 6974728 | Encapsulant mixture having a polymer bound catalyst | — | 2005-12-13 |
| 6924027 | Phase change thermal interface materials including exfoliated clay | Paul A. Koning | 2005-08-02 |
| 6841867 | Gel thermal interface materials comprising fillers having low melting point and electronic packages comprising these gel thermal interface materials | Paul A. Koning, Ashay Dani, Christopher L. Rumer | 2005-01-11 |
| 6777479 | Polyamide nanocomposites with oxygen scavenging capability | Linda Gail Bernard, Horst Clauberg, Michael John Cyr, John Walker Gilmer, Jeffrey Todd Owens +3 more | 2004-08-17 |
| 6713547 | Process for preparing high barrier nanocomposites | Robert B. Barbee, Jack Wesley Trexler, Jr., Rodney Layne Piner, John Walker Gilmer, Gary Wayne Connell +2 more | 2004-03-30 |
| 6653388 | Polymer/clay nanocomposite comprising a clay mixture and a process for making same | Robert B. Barbee, John Walker Gilmer, Tie Lan, Vasiliki Psihogios | 2003-11-25 |
| 6597575 | Electronic packages having good reliability comprising low modulus thermal interface materials | Paul A. Koning, Jinlin Wang | 2003-07-22 |
| 6552113 | Polymer-clay nanocomposite comprising an amorphous oligomer | Shriram Bagrodia, Linda Gail Bernard, Gary Wayne Connell, John Walker Gilmer, Tie Lan +4 more | 2003-04-22 |