Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334414 | Power semiconductor device with dual heat dissipation structures | Jayaganasan Narayanasamy, Chii Shang Hong, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2025-06-17 |
| 11908771 | Power semiconductor device with dual heat dissipation structures | Jayaganasan Narayanasamy, Chii Shang Hong, Chee Ming Lam, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2024-02-20 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Oliver Markus Kreiter, Ludwig Busch, Mei Fen Hiew, Tian See Hoe, Elvis Keli +7 more | 2023-04-04 |