Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334414 | Power semiconductor device with dual heat dissipation structures | Jayaganasan Narayanasamy, Angel Enverga, Chii Shang Hong, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2025-06-17 |
| 11908771 | Power semiconductor device with dual heat dissipation structures | Jayaganasan Narayanasamy, Angel Enverga, Chii Shang Hong, Sanjay Kumar Murugan, Subaramaniym Senivasan | 2024-02-20 |
| 11362023 | Package lead design with grooves for improved dambar separation | Jayaganasan Narayanasamy, Meng How Chong, Elmer Senorin Holgado, Sanjay Kumar Murugan, Arivindran Navaretnasinggam +2 more | 2022-06-14 |