Issued Patents All Time
Showing 26–50 of 76 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9812373 | Semiconductor package with top side cooling heat sink thermal pathway | Christian Fachmann, Ralf Otremba, Franz Stueckler | 2017-11-07 |
| 9786584 | Lateral element isolation device | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel | 2017-10-10 |
| 9754862 | Compound semiconductor device including a multilevel carrier | Ralf Otremba | 2017-09-05 |
| 9748166 | Semiconductor devices including control and load leads of opposite directions | Ralf Otremba | 2017-08-29 |
| 9735078 | Device including multiple semiconductor chips and multiple carriers | Ralf Otremba, Oliver Haeberlen, Matteo-Alessandro Kutschak | 2017-08-15 |
| 9620472 | Method of manufacturing an electronic component | Ralf Otremba, Oliver Häberlen | 2017-04-11 |
| 9620467 | Electronic component | Oliver Haeberlen, Ralf Otremba, Gerhard Prechtl | 2017-04-11 |
| 9595487 | Circuit arrangement and method for manufacturing the same | Ralf Otremba, Anton Mauder | 2017-03-14 |
| 9525063 | Switching circuit | Ralf Otremba, Rainald Sander | 2016-12-20 |
| 9478484 | Semiconductor packages and methods of formation thereof | Ralf Otremba, Chee Voon Tan | 2016-10-25 |
| 9449902 | Semiconductor packages having multiple lead frames and methods of formation thereof | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel | 2016-09-20 |
| 9443787 | Electronic component and method | Ralf Otremba, Oliver Häberlen | 2016-09-13 |
| 9412626 | Method for manufacturing a chip arrangement | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Bernd Roemer +1 more | 2016-08-09 |
| 9373566 | High power electronic component with multiple leadframes | Ralf Otremba, Teck Sim Lee | 2016-06-21 |
| 9368435 | Electronic component | Ralf Otremba, Dominic Maier, Chooi Mei Chong | 2016-06-14 |
| 9362240 | Electronic device | Khalil Hosseini, Joachim Mahler, Ralf Otremba, Josef Hoeglauer, Juergen Schredl +1 more | 2016-06-07 |
| 9263440 | Power transistor arrangement and package having the same | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel | 2016-02-16 |
| 9230880 | Electronic device and method for fabricating an electronic device | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Teck Sim Lee, Xaver Schloegel | 2016-01-05 |
| 9196577 | Semiconductor packaging arrangement | Ralf Otremba, Josef Höglauer, Jürgen Schredl, Xaver Schlögel | 2015-11-24 |
| 9196554 | Electronic component, arrangement and method | Ralf Otremba, Josef Höglauer, Jürgen Schredl, Xaver Schlögel | 2015-11-24 |
| 9184066 | Chip arrangements and methods for manufacturing a chip arrangement | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Bernd Roemer +1 more | 2015-11-10 |
| 9147628 | Package-in-packages and methods of formation thereof | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel | 2015-09-29 |
| 9147631 | Semiconductor power device having a heat sink | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel | 2015-09-29 |
| 9117786 | Chip module, an insulation material and a method for fabricating a chip module | Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel | 2015-08-25 |
| 9099454 | Molded semiconductor package with backside die metallization | Ulrich Wachter, Veronika Huber, Thomas Kilger, Ralf Otremba, Bernd Stadler +3 more | 2015-08-04 |