Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10519030 | Transducer package with integrated sealing | Klaus Elian, Thomas Mueller, Horst Theuss, Mathias Vaupel | 2019-12-31 |
| 9780061 | Molded chip package and method of manufacturing the same | Horst Theuss | 2017-10-03 |
| 9548248 | Method of processing a substrate and a method of processing a wafer | Frank Pueschner, Bernhard Schaetzler | 2017-01-17 |
| 9324642 | Method of electrically isolating shared leads of a lead frame strip | Frank Puschner, Bernhard Schätzler, Teck Sim Lee, Pei Pei Kong, Boon Huat Lim | 2016-04-26 |