Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218030 | Electronic module comprising a semiconductor package with integrated clip and fastening element | Edward Fuergut, Peter Eibl, Horst Groeninger, Martin Gruber, Philipp Seng | 2025-02-04 |
| 12211761 | Protector cap for package with thermal interface material | Nee Wan Khoo | 2025-01-28 |
| 11769701 | Protector cap for package with thermal interface material | Nee Wan Khoo | 2023-09-26 |
| 11641779 | Thermoelectric devices and methods for forming thermoelectric devices | Alexander Breymesser, Manfred Mengel, Andreas Niederhofer | 2023-05-02 |
| 11276680 | Power semiconductor device with integrated temperature protection | Daniel Pedone, Hans-Joachim Schulze, Rolf Gerlach, Anton Mauder, Hubert Rothleitner +3 more | 2022-03-15 |
| 10734250 | Method of manufacturing a package having a power semiconductor chip | Thomas Basler, Edward Fuergut, Ralf Otremba | 2020-08-04 |
| 10256119 | Method of manufacturing a semiconductor power package | Thomas Basler, Edward Fuergut, Ralf Otremba | 2019-04-09 |
| 9922910 | Functionalized interface structure | Ralf Otremba, Edward Fuergut, Hsieh Ting Kuek, Teck Sim Lee, Sanjay Kumar Murugan +1 more | 2018-03-20 |
| 9837288 | Semiconductor power package and method of manufacturing the same | Thomas Basler, Edward Fuergut, Ralf Otremba | 2017-12-05 |