Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026580 | Semiconductor device package with integrated heat spreader | — | 2011-09-27 |
| 7923289 | Process for fabricating a semiconductor package | Andy Farlow | 2011-04-12 |
| RE41719 | Power MOSFET with integrated drivers in a common package | Daniel M. Kinzer, Tim Sammon, Adam Amali | 2010-09-21 |
| 7745930 | Semiconductor device packages with substrates for redistributing semiconductor device electrodes | Norman Connah, Phillip Adamson, Hazel Schofield | 2010-06-29 |
| 7678609 | Semiconductor package with redistributed pads | — | 2010-03-16 |
| 7678680 | Semiconductor device with reduced contact resistance | Sven Fuchs | 2010-03-16 |
| 7671455 | Semiconductor device package with integrated heat spreader | — | 2010-03-02 |
| 7547964 | Device packages having a III-nitride based power semiconductor device | Norman Connah | 2009-06-16 |
| 7402507 | Semiconductor package fabrication | Martin Standing, Robert J. Clarke, Andrew N. Sawle, Kenneth McCartney | 2008-07-22 |
| 7382051 | Semiconductor device with reduced contact resistance | Sven Fuchs | 2008-06-03 |
| 7365423 | Redistributed solder pads using etched lead frame | — | 2008-04-29 |
| 7345563 | Embedded inductor for semiconductor device circuit | — | 2008-03-18 |
| 7274100 | Battery protection circuit with integrated passive components | Tim Sammon | 2007-09-25 |
| 7250672 | Dual semiconductor die package with reverse lead form | Ajit Dubhashi, Jorge Cerezo, Leigh Cormie, Vijay Bolloju | 2007-07-31 |
| 7235877 | Redistributed solder pads using etched lead frame | — | 2007-06-26 |
| 7227198 | Half-bridge package | Ajit Dubhashi, Norman Connah, Jorge Cerezo | 2007-06-05 |
| 7095099 | Low profile package having multiple die | Stephen Oliver, Marco Soldano, Glyn Connah, Ajit Dubhashi | 2006-08-22 |
| 7034344 | Integrated semiconductor power device for multiple battery systems | Tim Sammon, Chris Davis | 2006-04-25 |
| 6924175 | Clip-type lead frame for source mounted die | Tim Sammon, Rachel Anderson | 2005-08-02 |
| 6894397 | Plural semiconductor devices in monolithic flip chip | Tim Sammon | 2005-05-17 |
| 6891739 | H-bridge with power switches and control in a single package | Bruno Nadd, David Tam, Glyn Connah | 2005-05-10 |
| 6858922 | Back-to-back connected power semiconductor device package | — | 2005-02-22 |
| 6838735 | Trench FET with non overlapping poly and remote contact therefor | Daniel M. Kinzer, Ritu Sodhi | 2005-01-04 |
| 6723620 | Power semiconductor die attach process using conductive adhesive film | — | 2004-04-20 |
| 6717260 | Clip-type lead frame for source mounted die | Tim Sammon, Rachel Anderson | 2004-04-06 |