Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7821133 | Contact pad structure for flip chip semiconductor die | Slawomir Skocki, Philip Adamson | 2010-10-26 |
| 7745930 | Semiconductor device packages with substrates for redistributing semiconductor device electrodes | Norman Connah, Mark Pavier, Phillip Adamson | 2010-06-29 |
| 7476979 | Chip scale surface mounted device and process of manufacture | Martin Standing | 2009-01-13 |
| 7253090 | Chip scale surface mounted device and process of manufacture | Martin Standing | 2007-08-07 |
| 7122887 | Chip scale surface mounted device and process of manufacture | Martin Standing | 2006-10-17 |
| 6890845 | Chip scale surface mounted device and process of manufacture | Martin Standing | 2005-05-10 |
| D503691 | Conductive clip for a semiconductor package | Martin Standing | 2005-04-05 |
| 6767820 | Chip scale surface mounted device and process of manufacture | Martin Standing | 2004-07-27 |
| 6624522 | Chip scale surface mounted device and process of manufacture | Martin Standing | 2003-09-23 |