| RE41719 |
Power MOSFET with integrated drivers in a common package |
Daniel M. Kinzer, Mark Pavier, Adam Amali |
2010-09-21 |
| 7274100 |
Battery protection circuit with integrated passive components |
Mark Pavier |
2007-09-25 |
| 7034344 |
Integrated semiconductor power device for multiple battery systems |
Mark Pavier, Chris Davis |
2006-04-25 |
| 6924175 |
Clip-type lead frame for source mounted die |
Mark Pavier, Rachel Anderson |
2005-08-02 |
| 6894397 |
Plural semiconductor devices in monolithic flip chip |
Mark Pavier |
2005-05-17 |
| 6717260 |
Clip-type lead frame for source mounted die |
Mark Pavier, Rachel Anderson |
2004-04-06 |
| 6653740 |
Vertical conduction flip-chip device with bump contacts on single surface |
Daniel M. Kinzer, Aram Arzumanyan |
2003-11-25 |
| 6593622 |
Power mosfet with integrated drivers in a common package |
Daniel M. Kinzer, Mark Pavier, Adam Amali |
2003-07-15 |
| 6433424 |
Semiconductor device package and lead frame with die overhanging lead frame pad |
— |
2002-08-13 |